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OPB732 Ver la hoja de datos (PDF) - TT Electronics.

Número de pieza
componentes Descripción
Fabricante
OPB732
TTELEC
TT Electronics. TTELEC
OPB732 Datasheet PDF : 4 Pages
1 2 3 4
Storage Temperature
Operating Temperature
Lead Soldering Temperature (1/16” (1.6mm) from case for 5 seconds with soldering iron)(2)
Forward Current
Peak Forward current (2 μs pulse width, 0.1% Duty Cycle)
Reverse DC Voltage
Power Dissipation
Collector-Emitter Voltage
Collector DC Current
Power Dissipation
-40° C to +100° C
-40° C to +85° C
260° C
50 mA
1A
3V
100 mW
30 V
50 mA
100 mW
VF
Forward Voltage
IR
Reverse Current
-
- 1.8
V IF = 20 mA
-
- 100 μA VR = 2 V
V(BR)CEO
Collector-Emitter Breakdown Voltage
30
-
-
V IC = 100 µA, EE = 0 mw/cm2
ICEO
Collector-Emitter Dark Current
-
-
100
nA VCE = 10 V, EE = 0 mw/cm2
VCE(SAT)
Collector-Emitter Saturation Voltage(4)
-
- 0.4
V IC = 250 µA, IF = 30 mA , (4)
IC(ON)
On-State Collector Current(4)
0.25 -
-
mA VCE = 1 V, IF = 30 mA, (4)
ICX
Cross Talk
-
-
50
µA
VCE = 5 V, IF = 30 mA,
No reflective surface
Notes:
(1) All parameters tested using pulse technique.
(2) RMA flux is recommended. Duration can be extended to 10 seconds maximum when flow soldering.
(3) Methanol or isopropanol are recommended as cleaning agents. The plastic housing is soluble in chlorinated
hydrocarbons and keytones.
(4) Distance = 1” (from front of package to a 90% diffuse reflective white card)

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