HMC232 Ver la hoja de datos (PDF) - Micross Components
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HMC232 Datasheet PDF : 9 Pages
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v03.0907
HMC232
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 15 GHz
4
Absolute Maximum Ratings
RF Input Power (Vctl = -5V)
(0.5 - 15 GHz)
Control Voltage Range (A & B)
Channel Temperature
Thermal Resistance
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+30 dBm (@ +50 °C)
+1 V to -7.5 Vdc
150 °C
92 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1A
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Control Voltages
State
Low
High
Bias Condition
0 to -0.2V @ 10 uA Max.
-5V @ 10 uA Typ. to -7V @ 45 uA Typ.
Truth Table
Control Input
Signal Path State
A
B
RFC to RF1
RFC to RF2
High
Low
ON
OFF
Low
High
OFF
ON
Caution: Do not “Hot Switch” power levels greater than +26 dBm
(Vctl = 0/-5 Vdc).
Outline Drawing
4-4
Die Packaging Information [1]
Standard
Alternate
WP-17 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. BOND PADS ARE 0.004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE OF DIE IS GROUND
7. DIE THICKNESS IS .004”
8. NO CONNECTION REQUIRED FOR UNLABLED BOND PADS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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