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ADN2848ACP-32 Ver la hoja de datos (PDF) - Analog Devices

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ADN2848ACP-32 Datasheet PDF : 12 Pages
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ADN2848
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 V
Digital Inputs
(ALS, LBWSET, CLKSEL) . . . . . . . . . –0.3 V to VCC + 0.3 V
IMODN, IMODP . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 1.2 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . 150°C
32-Lead LFCSP Package
Power Dissipation2 . . . . . . . . . . . . . . . . (TJ max – TA)/θJA W
θJA Thermal Impedance3 . . . . . . . . . . . . . . . . . . . . . 32°C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . . . 300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2Power consumption formulae are provided on Page 6.
3θJA is defined when device is soldered in a 4-layer board.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
ADN2848ACP-32
–40°C to +85°C 32-Lead LFCSP
ADN2848ACP-32-RL –40°C to +85°C 32-Lead LFCSP
ADN2848ACP-32-RL7 –40°C to +85°C 32-Lead LFCSP
DATAP/DATAN
SETUP
tS
HOLD
tH
CLKP
Figure 1. Setup and Hold Time
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN2848 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
–3–

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