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AD8382ACP Datasheet PDF : 24 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 2. Absolute Maximum Ratings1
Parameter
Supply Voltages
AVCCx to AGNDx
DVCC to DGND
Input Voltages
Maximum Digital Input Voltage
Minimum Digital Input Voltage
Maximum Analog Input Voltage
Minimum Analog Input Voltage
Internal Power Dissipation2
LFCSP Package @ 25°C Ambient
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
Rating
18 V
4.5 V
DVCC + 0.5 V
DGND – 0.5 V
AVCC + 0.5 V
AGND – 0.5 V
3.84 W
0°C to 85°C
–65°C to +125°C
300°C
1Stresses above those listed under the Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those
indicated in the operational section of this specification is not implied.
Exposure to absolute maximum ratings for extended periods may reduce
device reliability.
2 48-lead LFCSP Package:
θJA = 26°C/W (JEDEC STD, 4-layer PCB in still air)
θJC = 20°C/W.
ΨJB = 11°C/W in Still Air
OVERLOAD PROTECTION
The AD8382 employs a two-stage overload protection circuit
that consists of an output current limiter and a thermal
shutdown. The maximum current at any output of the AD8382
is internally limited to 100 mA average. In the event of a
momentary short circuit between a video output and a power
supply rail (VCC or AGND), the output current limit is
sufficiently low to provide temporary protection.
The thermal shutdown “debiases†the output amplifier when the
junction temperature reaches the internally set trip point. In the
event of an extended short circuit between a video output and
power supply rail, the output amplifier current continues to
switch between 0 mA and 100 mA typ. with a period set by the
thermal time constant and hysteresis of the thermal trip point.
The thermal shutdown provides long-term protection by
limiting average junction temperature to a safe level.
EXPOSED PADDLE
To ensure a high degree of reliability, the exposed paddle must
be electrically connected to AVCC.
To ensure optimized thermal performance, the exposed paddle
must be thermally connected to the AVCC plane as described in
the Applications section.
AD8382
MAXIMUM POWER DISSIPATION
The maximum power that the AD8382 can safely dissipate is
limited by its junction temperature. The maximum safe junction
temperature for plastic encapsulated devices, as determined by
the plastic’s glass transition temperature, is approximately
150°C. Temporarily exceeding this limit may cause a shift in
parametric performance due to a change in stresses exerted on
the die by the package. Exceeding a junction temperature of
175°C for extended periods can result in device failure.
OPERATING TEMPERATURE RANGE
Although the maximum safe operating junction temperature is
higher, the AD8382 is 100% tested at a junction temperature of
125°C. Consequently, the maximum guaranteed operating
junction temperature is 125°C. To ensure operation within the
specified operating temperature range, it is necessary to limit
the maximum power dissipation to:
PDMAX ≈
(TJMAX–TA)
(θJA–0.9 × 3 Airflow
in
lfm)
where TJMAX = 125°C
AD8382 ON A 4–LAYER JEDEC PCB WITH THERMALLY OPTIMIZED
LANDING PATTERN AS DESCRIBED IN THE APPLICATION NOTES
2.00
1.75 120MHz
1.50
1.25
60Hz XGA
200 lfm
STILL AIR
500 lfm
1.00
Quiescent
0.75
0.50
65 70 75 80 85 90 95 100 105 110 115
MAXIMUM AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Temperature.
Note: Quiescent power dissipation is 0.74 W when operating
under the conditions specified in this data sheet.
When driving a 6-channel XGA panel with an input capacitance
of 200 pF, the AD8382 dissipates a total of 1.14 W when
displaying 1 pixel wide alternating white and black vertical lines
generated by a standard 60 Hz XGA input video.
The total power dissipation of the AD8382 is 1.67 W when
operating at the maximum specified frequency of 120 MHz,
under the conditions specified in this data sheet (Figure 2).
Rev. 0 | Page 5 of 24
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