ICM7555 Ver la hoja de datos (PDF) - Renesas Electronics
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ICM7555 Datasheet PDF : 13 Pages
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ICM7555, ICM7556
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
For the most recent package outline drawing, see M8.15.
INDEX
AREA
1
2
3
TOP VIEW
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
0.50 (0.20)
0.25 (0.01)
x 45°
8°
0°
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
5.00 (0.197)
4.80 (0.189)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
FN2867 Rev.10.01
Mar 5, 2020
2.20 (0.087)
SEATING PLANE
1.75 (0.069)
1.35 (0.053)
-C-
0.25(0.010)
0.10(0.004)
1
8
0.60 (0.023)
2
7
1.27 (0.050)
3
6
4
5
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
Page 10 of 13
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