M74VHC1GT04DFT1G(2013) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
M74VHC1GT04DFT1G
(Rev.:2013)
(Rev.:2013)
ON Semiconductor
M74VHC1GT04DFT1G Datasheet PDF : 6 Pages
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MC74VHC1GT04
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +7.0
V
−0.5 to +7.0
V
VCC = 0
−0.5 to 7.0
V
High or Low State
−0.5 to VCC + 0.5
IIK
IOK
IOUT
ICC
PD
qJA
TL
TJ
Tstg
VESD
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, VCC and GND
Power dissipation in still air
Thermal resistance
Lead temperature, 1 mm from case for 10 s
Junction temperature under bias
Storage temperature
ESD Withstand Voltage
VOUT < GND; VOUT > VCC
SC−88A, TSOP−5
SC−88A, TSOP−5
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
−20
+20
+25
+50
200
333
260
+150
−65 to +150
> 2000
> 400
N/A
mA
mA
mA
mA
mW
_C/W
°C
°C
°C
V
ILatchup Latchup Performance
Above VCC and Below GND at 125°C (Note 4)
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC DC Supply Voltage
VIN DC Input Voltage
VOUT DC Output Voltage
TA
Operating Temperature Range
tr , tf Input Rise and Fall Time
Min
3.0
0.0
VCC = 0
0.0
High or Low State
0.0
−55
VCC = 3.3 V ± 0.3 V
0
VCC = 5.0 V ± 0.5 V
0
Max
5.5
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
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