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BYW29E-200(2012) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
BYW29E-200
(Rev.:2012)
NXP
NXP Semiconductors. NXP
BYW29E-200 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to mounting base
thermal resistance from junction to ambient
Conditions
see Figure 3
in free air
10
Zth(j-mb)
(K/W)
1
BYW29E-200
Ultrafast power diode
Min Typ Max Unit
-
-
2.7 K/W
-
60
-
K/W
003aaj513
10-1
P
δ = tp
T
10-2
10-3
10-6
10-5
10-4
10-3
10-2
10-1
tp
t
T
1
10
tp (s)
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width
BYW29E-200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 20 March 2012
© NXP B.V. 2012. All rights reserved.
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