ISL8200MM Ver la hoja de datos (PDF) - Renesas Electronics

Número de pieza

componentes Descripción

Fabricante

ISL8200MM

Complete Current Share 10A DC/DC Power Module

Renesas Electronics 

ISL8200MM

Pin Descriptions (Continued)

PIN

NUMBER

PIN

NAME

PIN DESCRIPTION

23

NC

Not internally connected.

PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the PHASE thermal pad. Potential should be floating and

not electrically connected to anything except PHASE pin.

PD2 VIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the VIN thermal pad. Potential should be floating and

not electrically connected to anything except VPVIN pin.

PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the PGND thermal pad. Potential should be floating and

not electrically connected to anything except PGND pin.

PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the VOUT thermal pad. Potential should be floating and

not electrically connected to anything except VOUT pin.

Typical Application Circuits

ISL8200MMREP

(See Table 1,

VOUT - RSET on page 13)

FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT

FN7690 Rev 2.00

Mar 15, 2013

Page 5 of 24

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