ISL59830
Typical Performance Curves (Continued)
3.25
3
2.75
2.5
50
AV=+2
CL=3.9pF
250
450
650
850
1050
LOAD RESISTANCE ()
FIGURE 23. MAXIMUM OUTPUT MAGNITUDE vs LOAD
RESISTANCE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1
791mW
0.8
0.6
JA =Q1S5O8°PC1/6W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.8
1.6
1.4
1.2 1.116W
1
0.8
0.6
JA =Q11S2O°CP/1W6
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7489 Rev.1.00
May 4, 2006
1.6
BACKDRIVE ACROSS 5 RESISTOR
TYPICAL CHANNEL
1.2
VCC = 3.3V
0.8
0.4
0
0
1
2
3
4
5
BACKDRIVE VOLTAGE (V)
FIGURE 24. BACKDRIVE VOLTAGE vs CURRENT
AMP DISABLED OUTPUT LOADING
Block Diagram
VCC
Y RIN
REFERENCE
Pb GIN
+
6dB
-
+
6dB
-
ROUT
GOUT
Pr BIN
VOUT = 2VIN - VREFERENCE
+
6dB
-
BOUT
DVCC
CHARGE
PUMP
VEE-OUT
VEE
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