HSMB-A100 Ver la hoja de datos (PDF) - Avago Technologies
Número de pieza
componentes Descripción
Fabricante
HSMB-A100 Datasheet PDF : 13 Pages
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0.5
0.4
0.3
0.2
0.1
0
GaP/AlGaAs/
AlInGaP
-0.1
-0.2
-0.3
-100 -50
InGaN/GaN
0
50 100 150
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
1.0
0.8
0.6
0.4
0.2
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Radiation Pattern.
HSMx-A100 g 6
217 C
200 C
150 C
255 - 260 C
3 C/SEC. MAX.
3 C/SEC. MAX.
60 - 120 SEC.
10 to 30 SEC.
6 C/SEC. MAX.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
4.50
1.50
TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
200
150
100
50
30
0
FLUXING
PREHEAT
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 9. Recommended wave soldering profile.
8
2.60
SOLDER RESIST
Figure 10. Recommended soldering pad pattern.
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