EL7554 Ver la hoja de datos (PDF) - Renesas Electronics
Número de pieza
componentes Descripción
Fabricante
EL7554 Datasheet PDF : 14 Pages
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EL7554
Typical Performance Curves (Continued)
VIN = VD = 3.3V, VO = 1.8V, IO = 4A, L = 2.2µH, CIN = 2x10µF, COUT = 47µF, COSC = 220pF, TA = +25°C unless otherwise noted.
610
0.8
605
VIN=5V
0.6
0.4
600
0.2
595
0.0
590
VIN=3.3V
-0.2
585
0
0.5 1 1.5 2 2.5 3 3.5 4
IO (A)
FIGURE 7. FS vs IO
-0.4
0
1
2
3
4
IO (A)
FIGURE 8. LOAD REGULATIONS
50
CONDITION:
28 Ld HTSSOP THERMAL PAD
45
SOLDERED TO 2-LAYER PCB
WITH 0.039" THICKNESS AND
1 OZ. COPPER ON BOTH SIDES
40
35
30
25
1
2
3
4
5
6
7
8
9
PCB AREA (in2)
FIGURE 9. HTSSOP THERMAL RESISTANCE vs PCB AREA
(NO AIR FLOW)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7360 Rev 5.00
November 5, 2007
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
Page 7 of 14
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