ACPM-7311-BLKR Ver la hoja de datos (PDF) - Avago Technologies
Número de pieza
componentes Descripción
Fabricante
ACPM-7311-BLKR Datasheet PDF : 16 Pages
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PCB Design Guidelines
Stencil Design Guidelines
The recommended ACPM-7311 PCB land pattern is shown
in Figure 15 and Figure 16. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
0.1
0.6
0.4
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 17. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.6
0.5
0.85
0.25
Figure 15. Metallization
0.7
0.5
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
0.4
1.6
0.85
2.0
Figure 17. Solder Paste Stencil Aperture
0.85
2.4
Figure 16. Solder Mask Opening
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