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2508051817Y0 Ver la hoja de datos (PDF) - Unspecified

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2508051817Y0
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2508051817Y0 Datasheet PDF : 3 Pages
1 2 3
Chip Beads (2508051817Y0)
Part Number: 2508051817Y0
MULTI- LAYER CHIP BEAD
Fair- Rite offers a broad selection of cost effective multi- layer chip beads to suppress conducted EMI signals. Chip beads can be
used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate
automated placements and allow for a dense packaging of circuit boards.
Chip Beads are available in standard, high and GHz signal speeds.
Recommended Soldering Profile
Packaging Options:
- All multi- layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.
The suggested land patterns are in accordance to the latest revision of IPC-7351.
Weight: 0.01 (g)
Package Size: 0805 (2012)
Dim mm mm tol nominal inch
A 0.9 ±0.20 0.035
B 1.25 ±0.20 0.049
C 2 ±0.20 0.079
D 0.5 ±0.30 0.02
Land Patterns
V
W
0.60
(0.024”)
1.90
(0.075”)
X
1.50
(0.059”)
inch misc.
_
_
_
_
Reel Information
Tape Width Pitch
mm
mm
8
4
Y
Z
1.30
(0.051”)
_
Parts 7"
Reel
4000
Parts 13"
Reel
10000
Parts 14"
Reel
_

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