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PACDN006MR Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
PACDN006MR
ON-Semiconductor
ON Semiconductor ON-Semiconductor
PACDN006MR Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
PACDN006
6-Channel ESD Protection
Array
Product Description
The PACDN006 is a diode array designed to provide six channels of
ESD protection for electronic components or subsystems. Each
channel consists of a pair of diodes that steer an ESD current pulse to
either the positive (VP) or negative (VN) supply. The PACDN006
protects against ESD pulses up to:
8 kV contact discharge, per International Standard
IEC 6100042
15 kV per Human Body Model MILSTD883, Method 3015
(based on a 100 pF capacitor discharging through a 1.5 kW
resistor)
This device is particularly wellsuited for portable electronics
(e.g., cellular phones, PDAs, notebook computers) because of its
small package footprint, high ESD protection level, and low loading
capacitance. It is also suitable for protecting video output lines and I/O
ports in computers and peripherals and is ideal for a wide range of
consumer electronics products.
The PACDN006 is available with RoHS compliant leadfree
finishing.
Features
Six Channels of ESD Protection
8 kV Contact, 15 kV Air ESD Protection per Channel
(IEC 6100042 Standard)
15 kV of ESD Protection per Channel (HBM)
Low Loading Capacitance (3 pF Typical)
Low Leakage Current is Ideal for BatteryPowered Devices
Available in Miniature 8Pin MSOP and 8Pin SOIC Packages
These Devices are PbFree and are RoHS Compliant
Applications
Consumer Electronic Products
Cellular Phones
PDAs
Notebook Computers
Desktop PCs
Digital Cameras and Camcorders
VGA (Video) Port Protection for Desktop and Portable PCs
http://onsemi.com
MSOP 8
MR SUFFIX
CASE 846AB
SOIC 8
SM SUFFIX
CASE 751BD
ELECTRICAL SCHEMATIC
87
65
VP
VN
1 2 34
MARKING DIAGRAM
006R
PACDN 006SM
006R
= PACDN006MR
PACDN 006SM = PACDN006SM
ORDERING INFORMATION
Device
PACDN006MR
PACDN006SM
Package
Shipping
MSOP 8 4000/Tape & Reel
(PbFree)
SOIC 8 2500/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2011
1
October, 2011 Rev. 5
Publication Order Number:
PACDN006/D

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