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P6SMB10A Ver la hoja de datos (PDF) - Jiangsu Yutai Electronics Co., Ltd

Número de pieza
componentes Descripción
Fabricante
P6SMB10A
CHENDA
Jiangsu Yutai Electronics Co., Ltd CHENDA
P6SMB10A Datasheet PDF : 4 Pages
1 2 3 4
Soldering Parameters
Reflow Condition
-FBEoGSFFBTTFNCMZ
TP
- Temperature Min (Ts(min))
150°C
Pre Heat -Temperature Max (Ts(max))
200°C
TL
- Time (min to max) (ts)
oTFDT
Ts(max)
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
Ts(min)
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow -Temperature (TL) (Liquidus) 217°C
25˚C
- Time (min to max) (ts)
oTFDPOET
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
oTFDPOET
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
Do not exceed
8 minutes Max.
280°C
Ramp-up
tp
tL
Critical Zone
TL to TP
ts
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
Physical Specifications
Weight
Case
Polarity
Terminal
0.003 ounce, 0.093 grams
JEDEC DO214AA. Molded plastic body
over glass passivated junction
Color band denotes cathode except
Bidirectional.
Matte Tin-plated leads, Solderable per
JESD22-B102D
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106

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