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CBT3245ABQ(2019) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
CBT3245ABQ
(Rev.:2019)
NXP
NXP Semiconductors. NXP
CBT3245ABQ Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Nexperia
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
CBT3245A
Octal bus switch
SOT360-1
D
y
Z
20
c
11
E
A
X
HE
vM A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3 )
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT360-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig. 9. Package outline SOT360-1 (TSSOP20)
CBT3245A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 30 April 2019
© Nexperia B.V. 2019. All rights reserved
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