CS464 Ver la hoja de datos (PDF) - ON Semiconductor

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componentes Descripción

Fabricante

CS464

Single Coil Predriver

ON Semiconductor 

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

PACKAGE THERMAL DATA

Lead Count

16 Lead SO Wide

D

Metric

English

Max Min Max Min

10.50 10.10 .413 .398

Thermal Data

RΘJC

typ

RΘJA

typ

16 Lead SO Wide

23

105

Surface Mount Wide Body (DW); 300 mil wide

°C/W

°C/W

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

0.51 (.020)

0.33 (.013)

2.49 (.098)

2.24 (.088)

1.27 (.050) BSC

2.65 (.104)

2.35 (.093)

1.27 (.050) 0.32 (.013)

0.40 (.016) 0.23 (.009)

REF: JEDEC MS-013

0.30 (.012)

D

0.10 (.004)

Flip-Chip

.525 ± .05

13X .165 ± .038

1.022

CA MB

0

1.020

CS

S

CR

.496

OUT

2.39

0

CS-464

Flip-Chip

IN+

.356

IC

.431

Test

1.022

.279

0

.382

.0302 MAX

Bump Locations, Bump Side Up

IN- Gnd

VCC

1.021

13X .095 ± .045

2.14

0

Note: All dimensions in millimeters.

D

1.017

Ordering Information

Part Number

CS464H

CS464YDW16

CS464YDWR16

Description

Flip-Chip

16 Lead SO Wide

16 Lead SO Wide (tape & reel)

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mation and the latest available information, please contact

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© Semiconductor Components Industries, LLC, 2000

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