CS4172 Ver la hoja de datos (PDF) - ON Semiconductor

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componentes Descripción

Fabricante

CS4172

Single Air-Core Gauge Driver

ON Semiconductor 

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

Lead Count

16 Lead PDIP

16 Lead SO Wide*

Metric

Max Min

19.69 18.67

10.50 10.10

D

English

Max Min

.775 .735

.413 .398

Thermal

Data

RΘJC typ

RΘJA typ

Plastic DIP (N); 300 mil wide

PACKAGE THERMAL DATA

16 Lead

PDIP

42

80

16 Lead

SO Wide*

18

75

°C/W

°C/W

7.11 (.280)

6.10 (.240)

3.68 (.145)

2.92 (.115)

8.26 (.325)

7.62 (.300)

1.77 (.070)

1.14 (.045)

2.54 (.100) BSC

.356 (.014)

.203 (.008)

REF: JEDEC MS-001

0.39 (.015)

MIN.

.558 (.022)

.356 (.014)

D

Some 8 and 16 lead

packages may have

1/2 lead at the end

of the package.

All specs are the same.

Surface Mount Wide Body (DW); 300 mil wide

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

0.51 (.020)

0.33 (.013)

2.49 (.098)

2.24 (.088)

1.27 (.050) BSC

2.65 (.104)

2.35 (.093)

1.27 (.050) 0.32 (.013)

0.40 (.016) 0.23 (.009)

REF: JEDEC MS-013

Ordering Information

Part Number

CS4172XN16

CS4172XDWF16

CS4172XDWFR16

Description

16 Lead PDIP

16 Lead SO Wide*

16 Lead SO Wide* (tape & reel)

*Internally Fused Leads

0.30 (.012)

D

0.10 (.004)

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further notice to any products herein. For additional infor-

mation and the latest available information, please contact

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6

© Semiconductor Components Industries, LLC, 2000

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