TA76432FR(2002) Ver la hoja de datos (PDF) - Toshiba
Número de pieza
componentes Descripción
Fabricante
TA76432FR Datasheet PDF : 12 Pages
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Typical Application Circuits
TA76432FT/FC/F/FR/S
1.26 V Reference (VKA = VREF)
VIN
VOUT = 1.26 V
Shunt regulator (VKA > VREF)
VIN
R1
VOUT
R2
VREF
VOUT
=
VREF ççæ1+
è
R1
R2
÷÷ö + IREF
ø
× R1
Precautions during Use
(1) TA76432FT, TA76432FC, TA76432F/FR, TA76432S
These products contain MOS elements. Please take care to avoid generating static electricity when
handling these devices.
(2) TA76432FT, TA76432FC, TA76432F/FR, TA76432S
The oscillation frequency of these devices is determined by the value of the capacitor connected between
the anode and the cathode.
When establishing maximum operating condition parameters, please derate the maximum rating values
specified in these datasheets so as to allow an operational safety margin.
Use of a laminated ceramic capacitor is recommended.
(3) Precautions when handling anode pin of TA76432FT/TA76432FC
Pin 2 and pin 5 should normally be shorted together. If only pin 5 is used, pin 2 should either be left open
or always kept at a lower potential than pin 5. Do not leave pin 5 open and use pin 2 only.
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Cathode voltage
Cathode current
Cathode-anode reverse current
Reference voltage
Reference current
Reference-anode reverse current
TA76432FT
VKA
IK
-IK
VREF
IREF
-IREF
20
V
20
mA
10
mA
7
V
50
mA
10
mA
0.45 (Note 1)
Power dissipation
TA76432FC
0.2
PD
0.38 (Note 2) W
TA76432F/FR
0.5
TA76432S
0.8
TA76432FT
277 (Note 1)
TA76432FC
Thermal resistance
Rth
TA76432F/FR
625
328 (Note 2)
250
ºC/W
TA76432S
156
Operating temperature
Junction temperature
Storage temperature
Topr
-40~85
ºC
Tj
150
ºC
Tstg
-55~150
ºC
Note 1: Glass epoxy substrate mounting: 30 mm ´ 30 mm ´ 0.8 mmt (Cu pad area 35 mm2)
Note 2: Glass epoxy substrate mounting: 30 mm ´ 30 mm ´ 0.8 mmt (Cu pad area 50 mm2)
3
2002-07-12
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