CY74FCT162501ATPAC Ver la hoja de datos (PDF) - Cypress Semiconductor
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CY74FCT162501ATPAC Datasheet PDF : 7 Pages
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CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min. Typ.[8] Max. Unit
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Input Hysteresis[9]
VIK
Input Clamp Diode Voltage
IIH
Input HIGH Current
Standard
Bus Hold
VCC=Min., IIN=−18 mA
VCC=Max., VI=VCC
2.0
V
0.8
V
100
mV
−0.7 −1.2
V
±1
µA
±100
IIL
IBBH
IBBL
IBHHO
IBHLO
IOZH
Input LOW Current
Standard VCC=Max., VI=GND
Bus Hold
Bus Hold Sustain Current on Bus Hold Input[10] VCC=Min.,
VI=2.0V −50
VI=0.8V +50
Bus Hold Overdrive Current on Bus Hold In-
put[10]
VCC=Max., VI=1.5V
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
±1
µA
±100 µA
µA
µA
TBD mA
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
IOS
Short Circuit Current[11]
IO
Output Drive Current[11]
IOFF
Power-Off Disable
VCC=Max., VOUT=0.5V
VCC=Max., VOUT=GND
VCC=Max., VOUT=2.5V
VCC=0V, VOUT≤4.5V[12]
±1
µA
−80 −140 −200 mA
−50
−180 mA
±1
µA
Output Drive Characteristics for CY74FCT16501T
Parame-
ter
VOH
Description
Output HIGH Voltage
VOL
Output LOW Voltage
Test Conditions
VCC=Min., IOH=−3 mA
VCC=Min., IOH=−15 mA
VCC=Min., IOH=−32 mA
VCC=Min., IOL=64 mA
Min. Typ.[8] Max. Unit
2.5
3.5
V
2.4
3.5
2.0
3.0
0.2
0.55
V
Output Drive Characteristics for CY74FCT162501T, CY74FCT162H501T
Parame-
ter
Description
Test Conditions
Min. Typ.[8] Max. Unit
IODL
IODH
Output LOW Current[11]
Output HIGH Current[11]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115 150 mA
−60 −115 −150 mA
VOH
Output HIGH Voltage
VCC=Min., IOH=−24 mA
2.4
3.3
V
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
0.3
0.55
V
Notes:
8. Typical values are at VCC= 5.0V, TA= +25°C ambient.
9. This parameter is guaranteed but not tested.
10. Pins with bus hold are described in Pin Description.
11. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
12. Tested at +25°C.
3
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