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MAX1232ESA Ver la hoja de datos (PDF) - Maxim Integrated

Número de pieza
componentes Descripción
Fabricante
MAX1232ESA
MaximIC
Maxim Integrated MaximIC
MAX1232ESA Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MAX1232
Microprocessor Monitor
Chip Topography
PB RST
VCC
TD
TOL
GND
0.070" RST
(1.78 mm)
0.099"
(2.51 mm)
ST
RST
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX1232CWE
0°C to +70°C
16 Wide SO
MAX1232EPA
-40°C to +85°C
8 PDIP
MAX1232ESA
-40°C to +85°C
8 SO
MAX1232EWE
-40°C to +85°C
16 Wide SO
MAX1232MJA
-55°C to +125°C 8 CERDIP
*Contact factory for dice specifications.
Note: Devices in PDIP and SO packages are available in both
leaded(Pb) and lead(Pb)-free packaging. Specify lead(Pb)-free by
adding the “+” symbol at the end of the part number when order-
ing. Lead-free not available for CERDIP package.
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
8 CERDIP
8 PDIP
8 SO
16 Wide SO
PACKAGE
CODE
J8-2
P8+2
S8+4
W16+1
OUTLINE
NO.
21-0045
21-0043
21-0041
21-0042
LAND
PATTERN
NO.
90-0096
90-0107
www.maximintegrated.com
Maxim Integrated │7

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