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SSL21084T/1,118

GreenChip drivers for LED lighting

NXP Semiconductors. 

NXP Semiconductors

SSL2108X

Drivers for LED lighting

Equation 1 shows the relation between the maximum allowable power dissipation P and

the thermal resistance from junction to ambient.

Rthj – a = Tjmax – Tamb  P

(1)

Where:

Rth(j-a) = thermal resistance from junction to ambient

Tj(max) = maximum junction temperature

Tamb = ambient temperature

P = power dissipation

The thermal resistance as a function of the PCB area (Board: 0.8 mm thickness, 2 layers,

Bottom Cu coverage 90 %, Cu thickness 70 m (390 W/mK), Core material conductivity:

0.5 W/mK, 10 vias diameter 0.3 mm) is shown in Figure 7.

120

Rth(j-a)

(°C/W)

100

001aan701

80

(1)

60

(2)

(3)

40

20

0

2000

4000

6000

(1) Top Cu coverage 20 %

(2) Top Cu coverage 50 %

(3) Top Cu coverage 100 %

Fig 7. Rth(j-a) versus board dimensions

8000

10000

PCB area (mm2)

SSL2108X

Preliminary data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 1 — 9 September 2011

© NXP B.V. 2011. All rights reserved.

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