NX25P10 Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics

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NX25P10

1M-BIT, 2M-BIT AND 4M-BIT Serial Flash Memory with 40MHz SPI

NexFlash -> Winbond Electronics 

1M / 2M / 4M-BIT SERIAL FLASH MEMORY with 40MHz SPI

NX25P10, NX25P20 AND NX25P40

Table of Contents

1 Fast Read (0Bh) ........................................................................................................................................................ 15

Figure 9. Fast Read Instruction Sequence Diagram ................................................................................................ 15

Page Program (02h) ................................................................................................................................................. 16

2 Figure 10. Page Program Instruction Sequence Diagram ........................................................................................ 16

Sector Erase (D8h) ................................................................................................................................................... 17

Figure 11. Sector Erase Instruction Sequence Diagram .......................................................................................... 17

3 Bulk Erase (C7h) ...................................................................................................................................................... 18

Figure 12. Bulk Erase Instruction Sequence Diagram ............................................................................................. 18

Power-down (B9h) .................................................................................................................................................... 19

Figure 13. Deep Power-down Instruction Sequence Diagram ................................................................................... 19

4 Release Power-down / Device ID (ABh) ................................................................................................................... 20

Figure 14. Release Power-down Instruction Sequence ............................................................................................ 20

Figure 15. Release Power-down / Device ID Instruction Sequence Diagram ............................................................ 20

5 Read Manufacturer / Device ID (90h) ....................................................................................................................... 21

Figure 16. Read Manufacturer / Device ID Diagram ................................................................................................ 21

SPECIFICATIONS ANDTIMING DIAGRAMS ............................................................................................................... 22

Table 5. Absolute Maximum Ratings ....................................................................................................................... 22

6 Table 6. Operating Ranges ...................................................................................................................................... 22

Table 7. Power-up Timing and Write Inhibit Threshold .............................................................................................. 22

Figure 17. Power-up Timing and Voltage Levels ....................................................................................................... 22

Table 8. DC Electrical Characteristics (Preliminary) ................................................................................................ 23

7 Table 9. AC Measurement Conditions ..................................................................................................................... 23

Figure 18. AC Measurement I/O Waveform ............................................................................................................. 23

Table 10. AC Electrical Characteristics (Preliminary) ............................................................................................... 24

Figure 19. Serial Output Timing ............................................................................................................................... 25

8 Figure 20. Input Timing ........................................................................................................................................... 25

Figure 21. Hold Timing ............................................................................................................................................ 25

PACKAGING INFORMATION ........................................................................................................................................ 26

8-Pin SOIC 150-mil (Package Code N) ....................................................................................................................... 26

9 PRELIMINARY DESIGNATION .................................................................................................................................... 27

IMPORTANT NOTICE ................................................................................................................................................... 27

1 0 ORDERING INFORMATION ......................................................................................................................................... 27

LIFE SUPPORT POLICY ............................................................................................................................................. 27

TRADEMARKS ............................................................................................................................................................. 27

1 1 Document Revision History ........................................................................................................................................ 28

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NexFlash Technologies, Inc.

3

PRELIMINARY MKP-0009 Rev 6 NXSF040I-0405

04/04/05 ©

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