CXA2610N Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXA2610N

Laser Driver

Sony Semiconductor 

Package Outline

Unit: mm

∗5.0 ± 0.1

16PIN SSOP (PLASTIC)

16

9

A

+ 0.2

1.25 – 0.1

0.1

CXA2610N

1

b

B

8

0.65

0.13 M

+ 0.1

b=0.22 – 0.05

(0.22)

0.1 ± 0.1

b=0.22 ± 0.03

DETAIL B : SOLDER

DETAIL B : PALLADIUM

0° to 10°

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL A

SSOP-16P-L01

SSOP016-P-0044

NOTE: Dimension “∗” does not include mold protrusion.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

– 10 –

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