MGA-86563-BLKG Ver la hoja de datos (PDF) - Avago Technologies
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MGA-86563-BLKG Datasheet PDF : 8 Pages
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MGA-86563 Applications Information
Introduction
The MGA-86563 is a high gain, low noise RF amplifier for
use in wireless RF applications within the 0.5 to 6 GHz
frequency range. The MGA-86563 is a three-stage, GaAs
Microwave Monolithic Integrated Circuit (MMIC) amplifier
that uses internal feedback to provide wideband gain and
impedance matching.
A patented, active bias circuit makes use of current sources
to“re-use”the drain current in all three stages of gain, thus
minimizing the required supply current and decreasing
sensitivity to variations in power supply voltage.
Test Circuit
The circuit shown in Figure 10 is used for 100% RF testing
of Noise Figure and Gain. The input of this circuit is fixed
tuned for a conjugate power match (maximum power
transfer, or, minimum Input VSWR) at 2 GHz. Tests in this
circuit are used to guarantee the NF and G parameters
test
test
shown in the Electrical Specifications Table.
The 3.3 nH inductor, L1 (Coilcraft, Cary, IL or equivalent)
in series with the input of the amplifier matches the input
to 50Ω at 2 GHz.
The parameter test circuit uses a high impedance RF choke
to apply V to the MMIC while isolating the power supply
d
from the RF Output of the amplifier.
BOARD MATERIAL = 1/16" FR-4
RF
INPUT
L1
3.3 nH
w = 110
(50 Ω)
w = 110
I = 110
w = 15
I = 1000
C1
RFC
(28 nH)
w = 110
(50 Ω)
Vd
RF
OUTPUT
Figure 10. Test Circuit for 2 GHz.
Biasing
The MGA-86563 is a voltage-biased device and operates
from a single +5 volt power supply. With a typical current
drain of only 14 mA, the MGA-86563 is suitable for use
in battery powered applications. RF performance is very
stable over a wide variation of power supply voltage.
Since DC bias is applied to the MGA-86563 through the RF
Output pin, some method of isolating the RF from the DC
must be provided. An RF choke or length of high imped-
ance transmission line is typically used for this purpose.
SOT-363 PCB Layout
A PCB pad layout for the miniature SOT-363 (SC-70)
package used by the MGA-86563 is shown in Figure 12
(dimensions are in inches). This layout provides ample al-
lowance for package placement by automated assembly
equipment without adding parasitics that could impair
the high frequency RF performance of the MGA-86563.
The layout is shown with a nominal SOT-363 package
footprint superimposed on the PCB pads.
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Figure 12. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
Phase Reference Planes
The positions of the reference planes used to measure S-
Parameters and to specify *opt for the Noise Parameters are
shown in Figure 11. As seen in the illustration, the reference
planes are located at the extremities of the package leads.
REFERENCE
PLANES
TEST CIRCUIT
Figure 11. Reference Planes.
5
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