BTB12-600BRG Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

BTB12-600BRG

12 A Snubberless™, logic level and standard Triacs

STMicroelectronics 

BTA12, BTB12, T1205, T1210, T1235, T1250

Package information

2

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions

and product status are available at: www.st.com. ECOPACK® is an ST trademark.

2.1

D²PAK package information

• ECOPACK2® compliant

• Lead-free package leads finishing

• Molding compound resin is halogen-free and meets UL standard level V0

Figure 13. D²PAK package outline

E

A

E1

c2

E2

123

b2

e

b

G

Max resin gate protrusion: 0.5 mm (1)

A1

A2

A3

R

Gauge Plane

c

V2

(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.

DS2115 - Rev 12

page 7/16

Share Link: