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Número de pieza
componentes Descripción
HCS373K Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HCS373K
Radiation Hardened Octal Transparent Latch, Three-State
Intersil
HCS373K Datasheet PDF : 10 Pages
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HCS373MS
Die Characteristics
DIE DIMENSIONS:
2747 x 2693
µ
m
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCS373MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
LE
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS373 is TA14303A.
Spec Number
518845
355
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