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PACDN1404C Datasheet PDF : 3 Pages
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CALIFORNIA MICRO DEVICES
PACDN1404C
PACDN1408C
PACDN1416C
S P E C I F I C AT I O N S
(At 25°C unless specified otherwise)
Reverse Stand-off Voltage, I = 10µA
Min
Typ
Max
Unit
5.5
V
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, 10mA
5.6
6.6
8.0
V
–1.2
–0.8
–0.4
V
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883D, method 3015)
IEC 61000-4-2, contact discharge method
±30
kV
±25
kV
Clamping voltage during ESD discharge
MIL-STD-883D (Method 3015), 8kV
Positive
Negative
12
V
–8
V
Capacitance at 2.5V dc, 1MHz
Temperature Range:
Operating
Storage
39
pF
–40
85
°C
–65
150
* ESD applied between channel pin and ground, one at a time. All other channels are open. All GND pins grounded. This
parameter is guaranteed by design and characterization.
‘GND’ in this document refers to the lower supply voltage.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
250
EXH PH
225
200
175
150
125
100
75
50
25
0
48
Z2
Z3
Z4
Z5
RF
CD
EXH
97
145
194
242
290
339
387
435
Time (s)
Typical Solder Reflow Thermal Profile (No Clean Flux)
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com 8/4/2000
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