BGA2011 Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
BGA2011 Datasheet PDF : 12 Pages
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NXP Semiconductors
900 MHz high linear low noise amplifier
APPLICATION INFORMATION
Product specification
BGA2011
handbook, full pagewidth
VS
C4
VS
C3
VC
VC
BIAS
CIRCUIT
C5
RF in
C1
L1
IN SOT363
L2
C2
OUT
GND
RF out
MLD480
C6
stripline
Fig.2 Application circuit.
List of components (see Fig.2)
COMPONENT
DESCRIPTION
C1, C2
C3, C5
C4
C6
L1
L2
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
SMD inductor
SMD inductor
TYPICAL
APPLICATION
100 pF
22 nF
5.6 pF
HIGH IP3
APPLICATION
100 pF
22 nF
5.6 pF
2 x 100 nF
10 nH
8.2 nH
DIMENSIONS
0603
0603
0603
0805
0603
0603
Note
1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (r = 6.15),
board thickness = 0.64 mm, copper thickness = 35 m, gold thickness = 5 m.
2000 Dec 04
4
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