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MAX703 Ver la hoja de datos (PDF) - Maxim Integrated

Número de pieza
componentes Descripción
Fabricante
MAX703 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MAX703/MAX704
Chip Topography
0.070”
[1.778mm]
VOUT
VBATT
VCC
RESET
WDI
0.065”
[1.651mm]
Low-Cost Microprocessor Supervisory
Circuits with Battery Backup
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
8 PDIP
8 SO
8 CERDIP
PACKAGE
CODE
P8+1
S8+2
J8+2
OUTLINE
NO.
21-0043
21-0041
21-0045
LAND
PATTERN NO.
90-0096
GND
PFI PFO
SUBSTRATE MUST BE LEFT UNCONNECTED
www.maximintegrated.com
Maxim Integrated │9

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