RF3140PCBA-41X Ver la hoja de datos (PDF) - RF Micro Devices

Número de pieza

componentes Descripción

Fabricante

RF3140PCBA-41X

QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE

RF Micro Devices 

RF3140

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch

to 8μinch gold over 180μinch nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested

for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-

cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land and Solder Mask Pattern

A = 0.80 (mm) Sq. Typ.

Pin 1

8.39 (mm) Typ.

AA

7.00 (mm)

A

5.60 (mm)

A

4.20 (mm) Typ.

A

2.81 (mm)

A

1.40 (mm)

A

0.00

AA

A = 0.80 (mm) Sq. Typ.

B = 2.17 x 6.40 (mm)

Pin 1

A

8.39 (mm) Typ.

AAAAAAA

7.49 (mm) Typ.

6.60 (mm)

6.00 (mm)

5.20 (mm)

5.11 (mm)

7.00 (mm) Typ.

5.60 (mm) Typ.

AA

AA

AAA

AAA

A

3.30 (mm)

4.20 (mm) Typ.

AA

B

AAA

4.20 (mm)

3.21 (mm)

2.41 (mm)

2.81 (mm) Typ.

AA

AAA

1.78 (mm)

0.98 (mm)

0.89 (mm) Typ.

1.40 (mm) Typ.

AA

AAA

A

0.00

AAAAAAA

Metal Land Pattern

Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)

Solder Mask Pattern

Rev A9 DS060217

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

15 of 16

Share Link: