RF3322 Ver la hoja de datos (PDF) - RF Micro Devices
Número de pieza
componentes Descripción
Fabricante
RF3322 Datasheet PDF : 14 Pages
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Preliminary
RF3322
Evaluation Board Schematic
J1
1 NC
CS 2 CS
SDA 3 SDA
VCC
L2 (Ferrite)
30 Ω
L3 (Ferrite)
30 Ω
SCLK 4 SCLK VCC1
L1 (Ferrite)
30 Ω
C2
1 nF
+ C1
10 µF
(10 V)
JP1
1 VCC
2 GND
J5-1 5 SHDN
L4 (Ferrite)
J3-1
6
TXEN VCC2
30 Ω
7 NC
L5 (Ferrite)
R1
100 kΩ
8 NC
9 NC
VCC3
30 Ω
VCC
10 VCC
C5
1
20
11 NC
0.1 µF
J3
J4
1
J1-6
TXEN
1
VCC
2
2
3
3 GND
C6
0.1 µF
VCC2
3
12
VCC1
2
19
13 NC
14 NC
3
18
R2
100 kΩ
15 VCC
16 NC
17 NC
18 GND
19 GND
J2
RF IN
R4
75 Ω
C3
4
T1
1 nF
1:1
5
Power
Control
17
16
C10
15 pF
T2
R6
4:1 24 Ω
VCC3
J7
RF OUT
20 GND
21 GND
22 GND
6
R5
C4
75 Ω 1 nF
7
15
C11
15 pF
14
23 GND
24 GND
CS
C7
C9
8
13
220 pF
100 pF
25 GND
SDA
9
Gain Control
and Serial Bus
12
J5
J6
SCLK
10
11
1
J1-5
SHDN
1
VCC
Notes:
1. 4-layer board. 2nd layer is ground plane.
2. Place C5 and C6 as close to pin as possible.
3. C1 is tantalum, size code Y.
4. All other components are 0603 size.
5. Replace R6 with 0 Ω resistor if 75 Ω connector is used.
3322410-
2
2
3
3 GND
PCB Layout Considerations
The RF3322 evaluation board can be used as a guide for the layout in your application. Care should be taken in laying
out the RF3322 in other applications. The RF3322 will have similar results if the following guidelines are taken into con-
sideration:
• Make sure underside of package is soldered to a good ground on the PCB.
• Move C2, C9, C10, and C11 as close to T1 as possible.
• Keep input and output traces as short as possible.
• Ensure a good ground plane by using multiple vias to the ground plane.
Use a low noise power supply along with decoupling capacitors.
Rev A2 010518
3-33
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