ULC0404FC12C Ver la hoja de datos (PDF) - ProTek Devices.

Número de pieza

componentes Descripción

Fabricante

ULC0404FC12C

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

ProTek Devices. 

U0404 PACKAGE OUTLINE & DIMENSIONS

MOUNTING PAD LAYOUT - Option 2

C

HG

SOLDER PRINT

0.010” - 0.012” DIA.

A

D

DIE

SOLDER

BUMP

E

I

F

SOLDER PADS

SOLDER MASK

ULC0404FC3.3C

thru

ULC0404FC36C

PACKAGE DIMENSIONS

DIM MILLIMETERS

INCHES

A

0.51

F

0.15 SQ

G

0.71

H

0.99

I

0.51

0.020

0.006 SQ

0.028

0.039

0.020

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad

and outline: .xxx ± 0.05mm (± 0.002”).

3. Preferred: Using 0.1mm (0.004”) stencil.

TAPE & REEL ORIENTATION

Laser

Orientation

Line

Dual Die - 0404

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., ULC0404FC05C-T75-1.

3. 8mm Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2, i.e., ULC0404FC05C-T710-2.

4. Suffix - LF = Lead-Free, i.e., ULC0404FC05C-LF-T710-2.

Outline & Dimensions: Rev 4 - 9/04, 06022

COPYRIGHT © ProTek Devices 2007

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s

and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@protekdevices.com

Web Site: www.protekdevices.com

05168.R6 5/07

6

www.protekdevices.com

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