ULC0404FC12C Ver la hoja de datos (PDF) - ProTek Devices.

Número de pieza

componentes Descripción

Fabricante

ULC0404FC12C

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

ProTek Devices. 

U0404 PACKAGE OUTLINE & DIMENSIONS

PACKAGE OUTLINE

TOP

AB C

F

END

G

E

H

I

MOUNTING PAD LAYOUT - Option 1

C

A

D

HG

I

DIE

SOLDER

BUMP

E

SOLDER PRINT

0.010” - 0.012” DIA.

F

SOLDER PADS

SOLDER MASK

ULC0404FC3.3C

thru

ULC0404FC36C

PACKAGE DIMENSIONS

DIM MILLIMETERS

INCHES

A

0.56 NOM

0.022 NOM

B

0.86 NOM

0.034 NOM

C

1.0 ± 0.02

0.039 ± 0.001

E

0.15 SQ

0.006 SQ

F

1.0 ± 0.0254

0.039 ± 0.001

G

0.15 NOM

0.006 NOM

H

0.127 MAX

0.005 MAX

0.076 MIN

0.003 MIN

I

0.406 NOM

0.016 NOM

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad

and outline: .xxx ± 0.05mm (± 0.002”).

PAD DIMENSIONS

DIM MILLIMETERS

A

0.51

C

0.30

D

0.46

E

0.20

F

0.15 SQ

G

0.71

H

0.99

I

0.51

INCHES

0.020

0.012

0.018

0.008

0.006 SQ

0.028

0.039

0.020

NOTE:

1. Preferred: Using 0.1mm (0.004”) stencil.

05168.R6 5/07

5

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