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HA-2425 Ver la hoja de datos (PDF) - Intersil

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componentes Descripción
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HA-2425 Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
102 mils x 61 mils x 19 mils
2590µm x 1550µm x 483µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
SUBSTRATE POTENTIAL:
V-
BACKSIDE FINISH:
Gold, Nickel, Silicon, etc.
Metallization Mask Layout
HA-2420, HA-2425
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1.5kÅ
TRANSISTOR COUNT:
78
PROCESS:
Bipolar Dielectric Isolation
HA-2420, HA-2425
GND
VOS ADJ
VOS ADJ
HOLD CAP
V-
V+
OUTPUT
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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