XU1009-BD Ver la hoja de datos (PDF) - M/A-COM Technology Solutions, Inc.
Número de pieza
componentes Descripción
Fabricante
XU1009-BD Datasheet PDF : 9 Pages
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18.0-36.0 GHz GaAs MMIC
Transmitter
July 2007 - Rev 27-Jul-07
Mechanical Drawing
0.305
(0.012)
2.000
(0.079)
2
0.904
(0.036)
3
1.904 2.104 2.504
2.904
(0.075) (0.083) (0.099) (0.114)
45
6
7
U1009-BD
8
0.996
(0.039)
0.295
(0.012)
1
0.0
0.0
12
11
XU1009-BD
10
9
0.504
0.904
(0.020) (0.036)
2.305 2.704
(0.091) (0.106)
(Note: Engineering designator is 26TX0555)
3.200
(0.126)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.968 mg.
Bond Pad #1 (RF Out) Bond Pad #3 (IF1) Bond Pad #5 (Vg3) Bond Pad #7 (Vss) Bond Pad #9 (Vd3) Bond Pad #11 (IF2)
Bond Pad #2 (Vd1) Bond Pad #4 (Vg4) Bond Pad #6 (Vg2) Bond Pad #8 (LO) Bond Pad #10 (Vd2) Bond Pad #12 (Vg1)
Bias Arrangement
Vg3
Vd1 Vg4
Vg2
Vss
IF1
2
3
45
6
7
Bypass Capacitors - See App Note [2]
8 LO
RF 1
12
11
IF2
Vg1
Vd2
XU1009-BD
10
9
Vd3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 9
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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