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CGY196 Ver la hoja de datos (PDF) - Siemens AG

Número de pieza
componentes Descripción
Fabricante
CGY196
Siemens
Siemens AG Siemens
CGY196 Datasheet PDF : 15 Pages
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CGY 196
c) Reliability Considerations
This procedure yields the upper limit for the power dissipation for continuous wave (cw) and
pulse applications which corresponds to the maximum allowed channel temperature. For
best reliability keep the channel temperature low. The following formula allows to track the
individual contributions which determine the channel temperature.
Tch
=
Channel temperature (=
junction temperature)
( Pdiss x
RthChS ) +
Power dissipated in the chip. It Rth of device from channel to
does not contain decoupled RF- soldering point
power
TS
Temperature of soldering point,
measured or calculated
Siemens Aktiengesellschaft
5
Semiconductor Group
5
16.6.1998
HL HF19P9E8-G11a-A0s1

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