UPD16808 Ver la hoja de datos (PDF) - NEC => Renesas Technology

Número de pieza

componentes Descripción

Fabricante

UPD16808

MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT

NEC => Renesas Technology 

µPD16808

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions described below.

For soldering methods and conditions other than those listed below, consult NEC.

Surface mount type

For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting

Technology Manual (C10535E).

Soldering Method

Infrared reflow

VPS

Wave soldering

Partial heating

Soldering Conditions

Symbol of Recommended

Soldering

Peak package temperature: 230 °C, Time: 30 seconds MAX. (210 °C MIN.),

Number of times: 1, Number of days: NoneNote

IR30-00

Peak package temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),

Number of times: 1, Number of days: NoneNote

VP15-00

Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX.,

Number of times: 1, Number of days: NoneNote

WS60-00

Pin temperature: 300 °C MAX., Time: 10 seconds MAX.,

–

Number of days: NoneNote

Note The number of storage days at 25 °C, 65 % RH after the dry pack has been opened

Caution Do not use two or more soldering methods in combination (except partial heating).

10

Share Link: