HI-200 Ver la hoja de datos (PDF) - Renesas Electronics
Número de pieza
componentes Descripción
Fabricante
HI-200 Datasheet PDF : 11 Pages
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HI-200, HI-201
Die Characteristics
METALLIZATION:
Type: CuAl
Thickness: 16kÅ 2kÅ
Metallization Mask Layout
GND
2
IN 2
3
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 3.5kÅ 1kÅ
Silox Thickness: 12kÅ 2kÅ
WORST CASE CURRENT DENSITY:
2 x 105 A/cm2 at 25mA
HI-200
A2
A1
V+
1
10
9
8
IN 1
OUT 2
4
5
V-
FN3121 Rev 9.00
September 15, 2015
6
7
OUT 1
VREF
Page 9 of 11
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