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Número de pieza
componentes Descripción
MXP1126-C Ver la hoja de datos (PDF) - Microsemi Corporation
Número de pieza
componentes Descripción
Fabricante
MXP1126-C
Photo Transistor Chip
Microsemi Corporation
MXP1126-C Datasheet PDF : 1 Pages
1
2830 S. Fairview St.
Santa Ana, CA 92704
PH: 714.979.8220
FAX: 714.557.5989
Photo Transistor Chip
Features
•
Light Activated Photo Transistor Chip
•
Planar NPN
•
Aluminum Wire bondable
• Backside Metallization - Gold
• Die Attach methods: Eutectic or Epoxy
Electrical Characteristics @ 25
o
C
SYMBOL
CHARACTERISTIC
BV
CEO
BV
EBO
BV
CBO
ID
Collector-Emitter Voltage
Emitter-Base Voltage
Collector-Base Voltage
Collector Current
h
FE
Beta
CONDITIONS
I
C
= 100
µ
A
I
E
= 100
µ
A
I
C
= 100
µ
A
V
CE
=
10
Volts
V
CE
= 5 Volts, I
C
= 1 mA
MXP1126-C
MIN
TYP
MAX
UNITS
500
Volts
20
Volts
500
Volts
30
nAmps
25
Data Sheet # MSC1341.PDF
Updated:October 1998
Opto
Products
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