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MBD110DWT1G Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
MBD110DWT1G
ONSEMI
ON Semiconductor ONSEMI
MBD110DWT1G Datasheet PDF : 6 Pages
1 2 3 4 5 6
MBD110DWT1G,
MBD330DWT1G
Dual Schottky Barrier
Diodes
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOT363 package is a
solution which simplifies circuit design, reduces device count, and reduces
board space by putting two discrete devices in one small sixleaded
package. The SOT363 is ideal for lowpower surface mount applications
where board space is at a premium, such as portable products.
Surface Mount Comparisons:
Area (mm2)
Max Package PD (mW)
Device Count
SOT363
4.6
120
2
SOT23
7.6
225
1
Space Savings:
Package
SOT363
1 x SOT23
40%
2 x SOT23
70%
The MBD110DW and MBD330DW devices are spinoffs of our
popular MMBD101LT1 and MMBD301LT1 SOT23 devices. They are
designed for highefficiency UHF and VHF detector applications. Readily
available to many other fast switching RF and digital applications.
Features
Extremely Low Minority Carrier Lifetime
Very Low Capacitance
Low Reverse Leakage
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
MBD110DWT1G
VR
MBD330DWT1G
7.0
V
30
Forward Current (DC) MBD330DWT1G
IF
200 Max mA
Forward Power Dissipation TA = 25°C
PF
120
mW
Junction Temperature
TJ
55 to +125 °C
Storage Temperature Range
Tstg
55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
Anode 1
N/C 2
Cathode 3
6 Cathode
5 N/C
4 Anode
1
SC88 / SOT363
CASE 419B
STYLE 6
MARKING DIAGRAM
6
xx M G
G
1
xx = Device Code
Refer to Ordering Table,
page 2
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
September, 2012 Rev. 8
Publication Order Number:
MBD110DWT1/D

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