MC100LVEL38DW Ver la hoja de datos (PDF) - ON Semiconductor
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MC100LVEL38DW Datasheet PDF : 7 Pages
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MC100LVEL38
Table 6. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 7)
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
fmax
Maximum Toggle Frequency
(Divide by 2)
1.0 1.2
1.0 1.2
1.0 1.2
GHz
tPLH
Propagation Delay to Output
tPHL
CLK to Q (Differential) 810
CLK to Q (Single−Ended) 710
CLK to Phase_Out (Differential) 800
CLK to Phase_Out (Single−Ended) 750
MR to.Q 510
1010 850
1010 750
1000 840
1050 790
810 540
1050 900
1050 800
1040 890
1090 840
840 570
ps
1100
1100
1090
1140
870
tSKEW
Within-Device Skew (Note 8) Q0 − Q3
50
50
50
ps
All
75
75
75
Part-to-Part
Q0 − Q3 (Differential)
200
200
200
All
240
240
240
tS
Setup Time
EN to CLK 150
150
150
ps
DIVSEL to CLK
tH
Hold Time
CLK to EN 150
150
150
ps
CLK to Div_Sel 200
200
200
VPP
Input Swing (Note 9)
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
CLK 250
CLK 800
MR 700
1000 250
100
800
700
1000 250
100
800
700
1000 mV
100 ps
ps
tr, tf
Output Rise/Fall Times Q (20% − 80%) 280
550 280
550 280
550 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. VEE can vary ±0.3 V.
8. Skew is measured between outputs under identical transitions.
9. VPP(min) is minimum input swing for which AC parameters are guaranteed. The device will function reliably with differential inputs down to
100 mV.
Q
Driver
Device
Q
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VCC − 2.0 V
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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