CXG1050TN Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXG1050TN

Receiving Dual-Band Mixer

Sony Semiconductor 

Package Outline

Unit: mm

16PIN TSSOP(PLASTIC)

4.1

2.05

A

B

X2

16

9

0.2 S A B

X

1.2MAX

S

0.08 S

0.1 ± 0.05

0.25

X

1

8 X4

0.5

0.1 S A B

0.08 M S A

B

0° to 8°

CXG1050TN

0.2 ± 0.02

+ 0.036

0.22 – 0.03

DETAIL B

SONY CODE

EIAJ CODE

JEDEC CODE

TSSOP-16P-L01

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.03g

–8–

Share Link: