CXL5504M Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXL5504M Datasheet PDF : 11 Pages
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CXL5504P
8PIN DIP (PLASTIC)
+ 0.4
9.4 – 0.1
8
5
1
4
2.54
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-8P-01
DIP008-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.5g
CXL5504M/P
– 11 –
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