Drawing No.
K1101-13754-432 10/11
8.6 Resistance to Moisture
8.7 Soldering condition
Test condition
The quartz crystal unit shall be stored at a
temperature of 60±2°C wich relative humidity of
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1h,after
which measurements shall be made
1.) Material of solder
Kind … lead free solder paste
Melting point … +220±5°C
2.) Reflow temp.profile
Temp [°C]
Preheating
+150 to +180
Peak
+260±5
Total
―
Frequency shift : ±2ppm
3.) Hand Soldering +350°C 3 sec MAX
4.) Reflow Times 2 times
Time[sec]
150 (typ.)
10 (max.)
300 (max.)
Reflow temp.profile
8.8 Intensity for bending in circuit board
Solder this product in center of the circuit board of 40mm×100mm,
and add the deflection of 3mm as the bottom figure.
Test board : t=1.6mm
PUSH
20
board
10
R5
Product
45
45
R340
press jig
UNIT : mm
KYOCERA Crystal Device Corporation
KBS-5079E