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MP04HBN-16 Ver la hoja de datos (PDF) - Dynex Semiconductor

Número de pieza
componentes Descripción
Fabricante
MP04HBN-16
Dynex
Dynex Semiconductor Dynex
MP04HBN-16 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MP04---590
THERMAL AND MECHANICAL RATINGS
Symbol
Parameter
Rth(j-c)
Thermal resistance - junction to case
(per thyristor or diode)
R
th(c-hs)
Tvj
Tstg
-
Thermal resistance - case to heatsink
(per thyristor or diode)
Virtual junction temperature
Storage temperature range
Screw torque
-
Weight (nominal)
Test Conditions
dc
Half wave
3 Phase
Mounting torque = 5Nm
with mounting compound
Reverse (blocking)
-
Mounting - M6
Electrical connections - M10
-
Min. Max. Units
- 0.056 ˚C/kW
- 0.060 ˚C/kW
- 0.066 ˚C/kW
-
0.02 ˚C/kW
-
125
˚C
–40 130
˚C
- 6 (35) Nm (lb.ins)
- 12 (106) Nm (lb.ins)
-
1580
g
DYNAMIC CHARACTERISTICS - THYRISTOR
Symbol
Parameter
Test Conditions
Min. Max. Units
IRRM/IDRM Peak reverse and off-state current
At VRRM/VDRM, Tj = 125˚C
-
50 mA
dV/dt Linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125˚C
-
1000 V/µs
dI/dt Rate of rise of on-state current
From 67% VDRM to 1500A, gate source 1.5A,
-
500 A/µs
tr = 0.5µs, Tj = 125˚C
VT(TO)
Threshold voltage
At Tvj = 125˚C. See note 1
-
0.85 V
rT
On-state slope resistance
At T = 125˚C. See note 1
vj
-
0.38 m
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
3/10
www.dynexsemi.com

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