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NCV8401A Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
NCV8401A Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
NCV8401A, NCV8401B
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage Internally Clamped
VDSS
42
V
Drain−to−Gate Voltage Internally Clamped
Gate−to−Source Voltage
(RGS = 1.0 MW)
VDGR
VGS
42
V
"14
V
Drain Current − Continuous
ID
Internally Limited
Total Power Dissipation
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
PD
W
1.1
2.0
Thermal Resistance,
Junction−to−Case
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
RqJC
RqJA
RqJA
1.6
°C/W
110
60
Single Pulse Drain−to−Source Avalanche Energy
EAS
(VDD = 25 Vdc, VGS = 5.0 Vdc, IL = 3.65 Apk, L = 120 mH, RG = 25 W, TJstart = 150°C) (Note 3)
800
mJ
Load Dump Voltage (VGS = 0 and 10 V, RI = 2.0 W, RL = 3.0 W, td = 400 ms)
Operating Junction Temperature
VLD
65
V
TJ
−40 to 150
°C
Storage Temperature
Tstg
−55 to 150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Minimum FR4 PCB, steady state.
2. Mounted onto a 2square FR4 board
(1square, 2 oz. Cu 0.06thick single−sided, t = steady state).
3. Not subject to production testing.
+
ID
IG
+
VGS
GATE
DRAIN
SOURCE
VDS
Figure 1. Voltage and Current Convention
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