CXA1951Q Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA1951Q Datasheet PDF : 6 Pages
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Package Outline
Unit: mm
30
31
40PIN QFP (PLASTIC)
9.0 ± 0.4
+ 0.4
7.0 – 0.1
21
20
+ 0.35
1.5 – 0.15
+ 0.1
0.127 – 0.05
0.1
CXA1951Q
A
40
1
0.65
+ 0.15
0.1 – 0.1
11
10
+ 0.15
0.3 – 0.1
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
DETAIL A
QFP-40P-L01
∗QFP040-P-0707
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.2g
–6–
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