MPXA4250A Ver la hoja de datos (PDF) - Freescale Semiconductor
Número de pieza
componentes Descripción
Fabricante
MPXA4250A Datasheet PDF : 12 Pages
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FloroSilicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
P2
Sealed Vacuum Reference
RTV Die
Bond
Figure 2. Cross Sectional Diagram (Not to Scale)
Figure 2 illustrates the absolute pressure sensing chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX4250A/MPXA4250A series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability.
1.0 µF
0.01 µF
+5 V
Vout
Vs
IPS
GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling and
Output Filtering
(For additional output filtering, please refer to Application
Note AN1646.
Contact the factory for information regarding media
compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over temperature range of 0°
to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
5.0
4.5 Transfer Function:
MAX
4.0 VOUT = Vs* (0.004 x P-0.04) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
3.0
TYP
2.5
2.0
1.5
1.0
MIN
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPX4250A
4
Sensors
Freescale Semiconductor
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