SMP30 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

SMP30

Trisil™ for telecom equipment protection

STMicroelectronics 

SMP30

3

Package mechanical data

Package mechanical data

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 6. SMA dimensions

E1

D

E

A1

C

A2

L

Dimensions

Ref.

Millimeters

Inches

Min.

Max.

Min.

Max.

A1 1.90

2.45 0.075 0.094

A2 0.05

0.20 0.002 0.008

b

1.25

1.65 0.049 0.065

c

0.15

0.40 0.006 0.016

D

2.25

2.90 0.089 0.114

E

4.80

5.35 0.189 0.211

b

E1 3.95

4.60 0.156 0.181

L

0.75

1.50 0.030 0.059

Figure 11. Footprint (dimensions in mm)

1.4

(0.055)

2.63

(0.103)

1.4

(0.055)

1.64

(0.064)

5.43

(0.214)

Doc ID 5603 Rev 7

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